Self-assembly of magnetic patterns using stress-engineering approach
“Self-assembly of magnetic patterns using stress-engineering approach”
Complex 3-dimensional microstructures can be designed using stress-engineering approach. This technology was introduced in 2000 by the group of Prinz for semiconductor films. Thin multilayered film patterns with residual stresses between dissimilar layers tend to bend, roll or twist when released from the substrate by selective etching. One can essentially use well known origami techniques to assemble flat patterns into very complex shapes. Deformation of the film patterns provides new functions of these 3-D structures and also changes properties of the constituting materials. In particular the link between, stresses, shape and magnetic properties of magnetic microstructures will be discussed. Potential applications of this technology will be indicated.
Brief biographical sketch:
In 1991 Dr. Leszek Malkinski received his PhD degree in Physics from the Institute of Physics of the Polish Academy of Sciences in Warsaw, Poland. He gained his professional experience working as a visiting scholar in several European and the U.S. research institutes. Since 2002 he is with the University of New Orleans, where he has joint appointment with the Department of Physics, where he has his teaching duties, and the Advanced Materials Research Institute, where he performs his research on technology, properties and applications of magnetic materials. He is an author of about 100 publications in this field. He has also been involved in organizing several conferences on magnetism and he serves as an editor-in-chief of a new open access journal Nanomagnetism and an editor of Journal of Materials.